Product Introduction

When packaging precision electronic components in chip factories and connector manufacturers, manual operations face significant capacity bottlenecks, making it difficult to meet mass order delivery pressures. Furthermore, static electricity generated by human contact risks damaging chips, or uneven pressure may deform connector pins. Poor manual sealing can also cause components to fall off during transportation. This High frequency rotary table blister sealing machine features a circular station cyclic operation structure paired with an active static neutralization module. It reduces human contact to eliminate static risks and ensures firm sealing with precise temperature control, meeting the high-protection mass packaging needs of electronic components.

Product Features

Circular Station Cyclic Operation Structure: Multi-stations arranged in a ring automatically connect loading, sealing, and unloading processes, eliminating the need for manual waiting. Under stable conditions, it significantly increases hourly production capacity.

Active Static Neutralization Module: Uses high-voltage ion wind to quickly eliminate static on blister boxes and paper cards before sealing, fundamentally preventing electrostatic breakdown of chips and dust adhesion that affects connector conductivity.

Intelligent High-Frequency Spark Protection Device: When dust or foreign objects are detected on the blister box surface, the system cuts off high-frequency output in milliseconds to prevent material burnout and reduce production waste.

Dynamic Temperature-Controlled Sealing Head: The head temperature adjusts dynamically based on blister box material and thickness, compatible with PVC/PET commonly used in electronic component packaging. Sealing strength meets electronic industry transportation standards, and precise pressure adjustment prevents connector pin deformation.

Product Parameters

Item	Model 1	Model 2	Model 3
Power	5KW	8KW	10KW
Voltage	220V/380V	380V 3P	380V 3P
Frequency	27.12MHz	27.12MHz	27.12MHz
Input Power	10KVA	15KVA	18KVA
Rectifier	Silicon Diode	Silicon Diode	Silicon Diode
Electron Tube	7T69RB	7T85RB	7T85RB
Pressure	0.3-0.6MPa	0.4-0.7MPa	0.4-0.7MPa
Interval	1-99s	1-99s	1-99s
Inner Size	400×500mm	500×600mm	600×700mm
Upper Size	350×450mm	450×550mm	550×650mm
Lower Size	350×450mm	450×550mm	550×650mm
Welding Time	0.2-9.9s	0.2-9.9s	0.2-9.9s

Place Detail Page Pictures

Application Scenarios

High-Protection Chip Packaging Scenario: Chip factories need to package 10,000 precision chips daily, but manual packaging only achieves 3,000 units with a risk of static damage. The machine enables high-speed packaging via circular station cyclic operation + active static neutralization, ensuring no static risks and firm sealing, meeting mass production and high-protection needs of electronic components.

High-Reliability Industrial Connector Packaging Scenario: Industrial connectors are small with precise pins. Manual packaging risks pin deformation due to uneven pressure or dust adhesion from static that affects conductivity. The machine's dynamic temperature-controlled head adjusts pressure precisely, paired with active static neutralization, preventing pin deformation and static adsorption, meeting high-reliability packaging needs of industrial connectors.

FAQ

Q: Can the machine eliminate static risks at the source?

A: Equipped with an active static neutralization module, it uses high-voltage ion wind to quickly eliminate static on blister boxes and paper cards before sealing, fundamentally preventing electrostatic breakdown of chips and dust adhesion that affects connector conductivity.

Q: Can it adapt to anti-static blister boxes with ESD marks?

A: Supports sealing of anti-static blister boxes. The dynamic temperature-controlled head avoids high temperatures damaging the anti-static coating, meeting anti-static packaging needs of electronic components.

Q: Can sealed packaging meet electronic industry transportation standards?

A: High-frequency molecular fusion ensures tight bonding between blister boxes and paper cards. Most customers report sealed products pass standard drop and vibration tests in the electronic industry.

Q: Is it easy to replace molds for different chip blister box sizes?

A: Features a quick-release mold design. After familiarization, mold replacement requires no professional tools and takes minimal time, adapting to multi-specification electronic component packaging.

Q: Will sealing temperature fluctuate after continuous operation?

A: Equipped with a closed-loop temperature control system + air cooling, the head temperature fluctuation is controlled within a reasonable range during continuous operation, ensuring consistent mass sealing.

Q: Will odors be generated during sealing?

A: Dynamic temperature control prevents excessive melting of blister boxes and odor generation. The equipment also has a reasonable exhaust structure, meeting environmental protection requirements of electronic workshops.

Q: Can it seal blister boxes with conductive foam?

A: Supports sealing of blister boxes with conductive foam. The active static neutralization module simultaneously eliminates static on foam surfaces, ensuring electronic component safety.

Q: Can the machine adapt to paper cards with positioning holes?

A: The photoelectric positioning system accurately identifies paper card positioning holes, ensuring their integrity after sealing and adapting to subsequent assembly needs of automated production lines.

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